| 摘要 |
PROBLEM TO BE SOLVED: To provide a polished work free from defect by detecting the change in surface reflectance of a work to be polished, recognizing the unpolished part of the work on the basis of the detection value, and automatically generating and feeding back the polishing conditions of the unpolished part and the part except the unpolished part. SOLUTION: A polishing state measurement part 200 is formed of a detecting device 180 and a control device 190 electrically connected to the detecting device 180. The detecting device 180 detects the change of surface reflectance of a wafer 101. The control device 190 recognizes the unpolished part of the wafer 101 on the basis of the detection value from the detecting device 180, and automatically generates and feeds back the polishing conditions of the unpolished part and the part except the unpolished part. According to this, since the wafer 101 is polished while measuring its polished state, the whole surface of the wafer 101 can be polished so as to be free from under-polishing and minimized in over-polishing, and the polishing precision can be improved. |
