发明名称 |
Flip chip ball grid array package with laminated substrate |
摘要 |
Methods and apparatus pertaining to flip chip ball grid array packages are disclosed. A substrate comprises a base layer with a dielectric laminated thereon such that a cavity in the dielectric exposes the base layer. A die is then mounted to the exposed portion of the base layer. Preferably, an upper portion of the dielectric forms a frame for receiving a heat spreader.
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申请公布号 |
US6133064(A) |
申请公布日期 |
2000.10.17 |
申请号 |
US19990322064 |
申请日期 |
1999.05.27 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
NAGARAJAN, KUMAR;DESAI, KISHOR |
分类号 |
H01L21/56;H01L23/42;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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