发明名称 |
Multilayer wiring substrate and method for production thereof |
摘要 |
A multilayer wiring substrate using a resin composition comprising polyquinoline compound and bismaleimide compound as essential ingredients between wiring-carrying resin layers as insulating layers forms no void at the time of lamination, has an excellent adhesive property at various interfaces, has a heat stability after lamination and is high in reliability, so that, it is applicable to many fields not only including the multilayer wiring substrates capable of mounting LSI or tip carrier directly but also including multilayer wiring substrate for work station, mounting substrates for small-sized electronic devices such as camera and video for people's use, and high frequency multitip module multilayer substrate.
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申请公布号 |
US6132852(A) |
申请公布日期 |
2000.10.17 |
申请号 |
US19990267166 |
申请日期 |
1999.03.12 |
申请人 |
HITACHI, LTD. |
发明人 |
SUZUKI, MASAHIRO;TAKAHASHI, AKIO;TANAKA, MINORU;MATSUYAMA, HARUHIKO;AKAHOSHI, HARUO |
分类号 |
C08G73/06;H05K3/46;(IPC1-7):B32B15/00;B05D3/02;B32B27/00;H01B7/00 |
主分类号 |
C08G73/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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