| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin precursor which can be subjected to thermocompression bonding after patterning by blending a silicone having an epoxy group in the molecule. SOLUTION: A silicone of formula I is blended. Alternatively, a silicone of formula II is blended. Alternatively, a silicone of formula III is blended. In the formulae, n is 1-8. A patterned adhesive obtained by using the photosensitive polyimide resin precursor can be used for electronic devices of various forms having pits and projections on the surfaces and develops no voids even if subjected to the solder reflowing temperature. The photosensitive polyimide precursor is obtained, for example, by reacting an acid dianhydride component and a diamine component in a substantially equal molar ratio in an organic solvent. The silicone is preferably blended in an amount of 1-15 pts.wt. based on 100 pts.wt. of the total amount of the acid dianhydride component and the diamine component. Furthermore, a dihydropyridine derivative of formula IV is preferably blended in an amount of 10-30 pts.wt. as a sensitizer. In the formula, R1 to R5 are each H or a 1-4C organic group. |
