DEVICE AND METHOD FOR MACHINING LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To provide a device and method for machining the dam-bar section of a lead frame which can cope with the narrowing of the arranging pitch of leads or the production of many kinds of semiconductor devices without inducing any productivity deterioration nor cost increase nor causing development delays of new products. SOLUTION: Dam bars 16 are removed by means of the cutting force of an abrasive which is one component of a blasting material 3 composed of the abrasive and water and the impact force of the blasting material 3 as a high- speed fluid by jetting the blasting material 3 as the high-speed fluid upon a lead frame 1 from an exhaust nozzle 4a attached to the front end of a nozzle section 4 through a mask 5 having openings 5a in the areas corresponding to the dam bars 16. The blasting material 3 jetted for removing the dam bars 16 is collected in a tank after foreign matters are separated from the material 3 by means a separating machine and circularly used during a prescribed period.