ASYMMETRICAL MOLD CAPABLE OF COMPENSATING FOR WARPAGE OF FULL PACK PACKAGE

摘要

PURPOSE: An asymmetrical mold capable of compensating for the warpage of a full pack package is provided to maximize the radiant heat in the chip by compensating for the warpage of the full pack package. CONSTITUTION: An asymmetrical mold comprises a bottom cavity block(100) which is used for molding a full pack package(106) of a semiconductor device. A top cavity block(102) is installed on the bottom cavity block(100) corresponding to the bottom cavity block(100). An upper surface of the top cavity block(102) is inclined by a predetermined angle so that an upper portion and a lower portion of the full pack package(106) are asymmetrically formed so as to compensate for the warpage of the full pack package(106). A heat sink is attached to the top cavity block(102).