发明名称 |
A cooling unit for an integrated circuit package |
摘要 |
A cooling unit for an integrated circuit. The cooling unit may include a peltier device that may be coupled to the integrated circuit and a plurality of fins that are thermally coupled to the peltier device. The fins may be separated by at least one channel. The cooling unit may include a fan that generates a flow of fluid through the channel. |
申请公布号 |
AU3894000(A) |
申请公布日期 |
2000.10.16 |
申请号 |
AU20000038940 |
申请日期 |
2000.03.15 |
申请人 |
INTEL CORPORATION |
发明人 |
KENZO ISHIDA;SHUJI INOUE |
分类号 |
H05K7/20;F25B21/02;F28D15/02;H01L23/38;H01L23/427;H01L23/467;H01L35/30 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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