发明名称 A cooling unit for an integrated circuit package
摘要 A cooling unit for an integrated circuit. The cooling unit may include a peltier device that may be coupled to the integrated circuit and a plurality of fins that are thermally coupled to the peltier device. The fins may be separated by at least one channel. The cooling unit may include a fan that generates a flow of fluid through the channel.
申请公布号 AU3894000(A) 申请公布日期 2000.10.16
申请号 AU20000038940 申请日期 2000.03.15
申请人 INTEL CORPORATION 发明人 KENZO ISHIDA;SHUJI INOUE
分类号 H05K7/20;F25B21/02;F28D15/02;H01L23/38;H01L23/427;H01L23/467;H01L35/30 主分类号 H05K7/20
代理机构 代理人
主权项
地址