发明名称 EQUIPMENT FOR BONDING TAP ELEMENT ON GLASS SUBSTRATE
摘要 PURPOSE: An equipment for bonding a tap element on a glass substrate is provided to cool a support block and thus prevent the support block from being deformed due to a heat transferred from a heat block. CONSTITUTION: Heat blocks and support blocks(13) are arranged in parallel in a vertical direction. The heat blocks and the support blocks are connected with a plurality of bolts(15). A plurality of through holes are formed in a length direction of the support blocks(13). A pair of cooling passages(55) pass through the length direction to form openings on both sides. Radiating pins(51) are accommodated in the though holes. Lower end parts of the radiating pins correspond to upper parts of the heat blocks(31). A plurality of air passing holes(53) are arranged along the length direction of the radiating pins(51). The air passing holes(53) enlarges a plate area of the support blocks(13) and enlarge a contact surface with convection currents passing between the heat blocks and the support blocks(13). There is generated a local radiation of heat transferred from the heat locks to the support blocks(13), whereby the support blocks(13) can maintain a uniform temperature distribution as a whole. A heat exchange due to the convection currents passing through the air passing holes(53) further enlarges the radiation of the support blocks(13).
申请公布号 KR100267942(B1) 申请公布日期 2000.10.16
申请号 KR19970074541 申请日期 1997.12.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, CHANG BEOM
分类号 H05K13/04;(IPC1-7):H05K13/04 主分类号 H05K13/04
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