发明名称 MODULAR PACKAGING OF A COMPUTER SYSTEM
摘要 <p>A packaging configuration is provided for a computer system (200') that is adapted for operating multiple operating systems (170', 172', 174') in different partitions of the computer system (200'). The packaging configuration includes a main chassis (10) having a main circuit board (12). The packaging configuration also includes a processor assembly (100) configured for insertion into the main chassis (10). The processor assembly (100) has a circuit board (104) for connection to the main circuit board (12) upon insertion of the processor assembly (100). The packaging configuration also includes a processor subassembly (200) configured for insertion into the processor assembly (100). The processor subassembly (200) includes a circuit board (204) and a processor (302) and is configured for connection with a circuit board (104) in the processor assembly (100) upon insertion of the processor subassembly (200). The processor assembly (100) is removable from the main chassis (10) without powering down the computer system (200'), and the processor subassembly (200) is removable from the processor assembly (100) without powering down the computer system (200').</p>
申请公布号 WO2000060437(A1) 申请公布日期 2000.10.12
申请号 US2000008584 申请日期 2000.03.31
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