发明名称 Method of controlling heating of a part during automatic soldering thereof and apparatus for making the same
摘要 <p>The proposed method of controlling heating of a part during automatic soldering of a soldered part (1) being fastened inclusive filler material in a soldering fixture (3) between burners (4) of a soldering device is characterized in that during heating the part (1) to be soldered the profile of the filler material (2) is digitized and subjected to computer analysis, whereby after determining an instant of plastic deformation of the filler material (2) the heating of parts (1) to be soldered is finished. The apparatus for controlling heating temperature is formed by a scanning camera (5) and a radiation source (6) which are positioned one to another so that a beam (7) leaving the radiation source (6) passes through the filler material (2) profile being scanned by the scanning camera (5) connected to a control computer (8) that is in turn connected with control elements of the burners (4).</p>
申请公布号 CZ287284(B6) 申请公布日期 2000.10.11
申请号 CZ19980003519 申请日期 1998.11.03
申请人 THEMIS A. S. 发明人 BRODA MIROSLAV ING.;NOVOSAD BOHUMIR ING.
分类号 G05D23/00;B23K3/00;B23K3/04;G05D23/27;(IPC1-7):G05D23/00 主分类号 G05D23/00
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