发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in moldability, flame retardance, low water absorptivity and solder resistance by formulating specific amounts of an epoxy resin containing a large amount of carbon atoms derived from aromatics with a specified phenol resin, a curing accelerator and an inorganic filler. SOLUTION: This composition is obtained by including (A) an epoxy resin having >=70% carbon atom content derived from aromatics in the total carbon atoms in the epoxy resin represented by preferably formula I (R1 to R4 are each H or methyl) or formula II (R1 to R8 are each H, tertiary butyl or the like), (B) a phenol resin having >=70% carbon atom content derived from the aromatics in the total carbon atoms in the phenol resin and 140-300 phenolic hydroxyl group equivalents and (C) a curing accelerator and (D) an inorganic filler. In the above composition, the burning start temperature of the cured epoxy resin composition in a thermogravimetric analysis(TG) curve in an air atmosphere is >=280 deg.C when the amount W (wt.%) of the added component D is 88<=W<=94.
申请公布号 JP2000281877(A) 申请公布日期 2000.10.10
申请号 JP19990089665 申请日期 1999.03.30
申请人 SUMITOMO BAKELITE CO LTD 发明人 OTA MASARU
分类号 C08G8/08;C08G59/62;C08G61/10;C08K3/00;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08G8/08
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