| 摘要 |
PROBLEM TO BE SOLVED: To provide resin compositions suited for use in low hygroscopic resin molded articles, particularly adhesives and circuit connecting members for electronic parts. SOLUTION: Resin compositions comprise (A) a thermoplastic resin having a water absorption of 0.05-0.25 wt.% and a glass transition temperature of 110 deg.C-160 deg.C and (B) a three-dimensionally crosslinkable resin. The thermoplastic resin is preferably a polysulfone resin represented by the formula (wherein R1 is hydrogen or 1-2C alkyl; R2 is 4-13C straight-chain or branched alkyl; and n is an integer of 5-750) and further, is preferably soluble in an aromatic hydrocarbon solvent.
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