发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To enhance the EM resistance of a damascene wiring. SOLUTION: A wiring groove having a plurality of split islands 6 arrangement-formed at prescribed intervals on its bottom is formed, then an Al film, which is used as a DD wiring 8, is deposited in the wiring groove 4 in such a way as to fill the interior of the wiring groove 4, then the grain diameter of crystal grains 9 in the Al film is formed into a large grain diameter by an RTA and lastly, the surplus Al film on the outside of the groove 4 is removed to complete the DD wiring 8.
申请公布号 JP2000277519(A) 申请公布日期 2000.10.06
申请号 JP19990078144 申请日期 1999.03.23
申请人 TOSHIBA CORP 发明人 HASUNUMA MASAHIKO;USUI TAKAKIMI;SHIMA SHOHEI
分类号 H01L21/3205;(IPC1-7):H01L21/320 主分类号 H01L21/3205
代理机构 代理人
主权项
地址