| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring substrate that can form at higher density a through-hole conductive layer and assures conductivity of wiring conductor layer having high mechanical strength of insulation base material. SOLUTION: A plurality of sheets of a photo-curing ceramic sheet 1a, having a through-hole 3 are formed, by irradiating the predetermined position of a photosensitive ceramic green sheet 1 with a light beam, a wiring conductive layer 4a is formed to at least one photo-curing ceramic sheet 1a, while the power supply conductive layer or grounding conductive layer 6 and auxiliary conductive layer 7 are formed to at least the other photo-curing ceramic sheet 1a, and thereafter these sheets are laminated in the vertical direction and are then baked. |
