发明名称 SUBSTRATE DRYING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate drying method and a device, where an exhaust equipment can be dispensed with or simplified, and drying fluid can be smoothly supplied. SOLUTION: This drying method is carried out through a manner where a substrate 1 is housed in a processing tank 3, and drying fluid is supplied into the tank 3 making the liquid level of cleaning liquid 2 in the tank 3 descend relatively with respect to the substrate 1, by which the surface of the substrate 1 is dried out. In this case, a drying fluid is supplied as a liquid into the tank 3 and sprayed on the surface of the cleaning liquid 2 by the use of a nozzle 5 provided at the end of a feed pipe 4.
申请公布号 JP2000277481(A) 申请公布日期 2000.10.06
申请号 JP19990122696 申请日期 1999.04.28
申请人 TOHO KASEI KK;DAIKIN IND LTD 发明人 MAEDA TOKUO;WASHIMI KOJI;AIHARA MASARU;ONO MASAO;IZUMITANI NAOAKI
分类号 H01L21/304;B05B7/04;B08B3/04;H01L21/00;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址