发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, PRODUCTION OF RESIST PATTERN AND PRODUCTION OF PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition excellent in photosensitivity, resolution, adhesion or the like, by incorporating a polymer binder, a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and specified compounds or the like. SOLUTION: The photosensitive resin composition contains a polymer binder, a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule, a compound selected from a 2,4,5- triphenylimidazole dimer of formula I, an arylglycine compound of formula II and a boron salt compound of formula III, and a compound selected from a diaryliodonium salt compound of formula IV and a bis-sulfonium salt compound of formula V. In the formulae I-V, Z1-Z12 are each halogen, 1-15C alkyl or the like, Z13-Z20 are each H, halogen or the like, (s), (t), (u) to (x) and (a) to (d) are each an integer of 0-5 and (e) and (f) are each an integer of 0-4.
申请公布号 JP2000275831(A) 申请公布日期 2000.10.06
申请号 JP19990287292 申请日期 1999.10.07
申请人 HITACHI CHEM CO LTD 发明人 NATORI MICHIKO;HIDAKA TAKAHIRO
分类号 H05K3/06;G03F7/027;G03F7/029;G03F7/031;G03F7/032;G03F7/40;H05K3/18 主分类号 H05K3/06
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