| 摘要 |
PROBLEM TO BE SOLVED: To protect a semiconductor wafer itself or wirings or the like formed on the wafer against damage caused by static electricity, by a method where static electricity induced when contaminants attached to the surface of a semi conductor wafer as a work are removed by spouting out liquid droplets against the wafer is grounded. SOLUTION: Droplets 5 are sprayed on the surface of a semiconductor wafer 7 as a work to remove contaminants attached to the wafer 7. In this case, rinsing pure water 9 where carbon dioxide gas is dissolved is sprayed on the rear surface of the wafer 7, by which a current flowing from the charged droplets 5 to the wafer 7 is grounded outside through the rinsing pure water 9.
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