| 摘要 |
PROBLEM TO BE SOLVED: To provide a distributed constant element that is miniaturized without causing a change in its characteristic and can be fine-adjusted after the completion of the element. SOLUTION: A ground pattern 17 is formed on a rear side of a dielectric substrate A14 that is a base substance. A dielectric substrate B15 is formed on a dielectric substrate A14. The dielectric substrate B15 has a hollow part inside. Furthermore, a dielectric substrate C16 is provided on the dielectric substrate B15. Thus, a 1st space section 18 is formed by the dielectric substrate A14, the hollow part of the dielectric substrate B15 and the dielectric substrate C16. Moreover, a specific pattern is formed on the dielectric substrate C16. A shield layer 20 is placed on the dielectric substrate C16 via a 2nd space layer 19. A bonding member such as a solder 21 with a conductor section 22 inbetween bonds this shield layer 20. |
