| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor package, whereby external connection electrodes of a substrate can be aligned with high accuracy, in dicing with the substrate's external connection electrode surface adhered onto a flat support surface of a cutter, etc. SOLUTION: In this semiconductor package manufacturing method comprising dicing after a plurality of chips 11 are mounted on the surface 10a of a substrate 10, electrodes 13 are provided on a back surface 10b of the substrate 10, and the substrate 10 is aligned in the condition of the substrate 10 adhered to a flat support surface 14a, a light-permeable part aligned with electrodes 13 is formed on the substrate 10, the back surface 10b of the substrate 10 is adhered to the support surface 14a, and the alignment is made for dicing from the surface 10a of the substrate 10 to the light-permeable part as a reference.</p> |
