| 摘要 |
PROBLEM TO BE SOLVED: To make a fuse into a chip component so that reflow soldering can be applied thereto. SOLUTION: A two-layer ceramic substrate 11 is formed of glass ceramic having a heat conductivity lower than that of alumina. Terminal electrodes 12, 13 are formed on both sides of the ceramic substrate 11 while via-conductors 15 to 18 and internal-layer wiring patterns 19, 20 are formed within the ceramic substrate 11. Conductor lands 21 to 23 are formed on an upper surface of the ceramic substrate 11 while a thick-film resistor 24 is formed spanning two conductor lands 21, 22, and the resistance the thick-film resistor 24 is adjusted by laser trimming to its rated current. A thermal fuse 26 is disposed in a position close to an upper surface of the thick-film resistor 24, and the thermal fuse 26 is connected to conductor lands 22, 23 with high-temperature solder 27, 28. Thus, the thermal fuse 26 is combined with the thick-film resistor 24 into a chip component.
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