发明名称 PLASMA PROCESSING SYSTEM
摘要 A plasma processing system comprises a chamber capable of maintaining a vacuum inside, a discharge unit for evacuating the chamber, a gas supply unit for supplying process gas to the chamber, a lower electrode arranged in the chamber and adapted to support an object to be processed, and an upper electrode arranged opposite to the lower electrode. Outside the chamber is provided a high-frequency power supply, from which a power feeder extends to the lower electrode. Impedance adjustment means adjusts the impedance of a return current path that extends from the plasma of the process gas produced between the upper electrode and the lower electrode energized through the feeder by the high-frequency power supply back to the high-frequency power supply through the inner wall of the chamber.
申请公布号 WO0059018(A1) 申请公布日期 2000.10.05
申请号 WO2000JP02003 申请日期 2000.03.30
申请人 TOKYO ELECTRON LIMITED;SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. 发明人 KUBOTA, KAZUHIRO;KAWABATA, ATSUSHI;TOZAWA, SHIGEKI;ISHIKAWA, HIRAKU;NISHIBE, HARUHITO
分类号 H01L21/302;C23C16/50;C23C16/505;C23F4/00;H01J37/32;H01L21/205;H01L21/3065;H01L21/31;H05H1/46;(IPC1-7):H01L21/306 主分类号 H01L21/302
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