A VIA CONNECTOR AND METHOD OF MAKING SAME

摘要

An insulator substrate or printed circuit board (PCB) having a filled and plated via is provided. The insulator substrate (12) and the sidewalls of the via are plated with conductive layer (14) and the via is filled with an electrically conductive fill composition (18). Conductive cap layers (20, 22) are formed on both ends of the conductive fill composition in the via and the major surfaces of the insulator substrate and can be bonded to a surface mount contact as a land or a pad.