发明名称 Liquid material supply apparatus and method
摘要 An apparatus for supplying a low vapor pressure liquid material for deposition to a deposition chamber in which the low vapor pressure liquid material is pushed out of a pressurization passage by a pressure gas to a pressure liquid supply passage; a flow rate of the low vapor pressure liquid material is controlled by a flow rate control unit, and the flow rate of the low vapor pressure liquid is supplied to an evaporator and evaporated into vapor there; and the vapor is fed to the deposition chamber through a vapor feed passage provided with heating means for preventing the vapor from re-liquefying, whereby the liquid material for deposition is supplied stably and accurately.
申请公布号 US6126994(A) 申请公布日期 2000.10.03
申请号 US19970907007 申请日期 1997.08.06
申请人 TOKYO ELECTRON LIMITED 发明人 MURAKAMI, SEISHI;HATANO, TATSUO
分类号 H01L21/205;C23C16/00;C23C16/44;C23C16/448;H01L21/203;(IPC1-7):C23C16/00 主分类号 H01L21/205
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