发明名称 |
Liquid material supply apparatus and method |
摘要 |
An apparatus for supplying a low vapor pressure liquid material for deposition to a deposition chamber in which the low vapor pressure liquid material is pushed out of a pressurization passage by a pressure gas to a pressure liquid supply passage; a flow rate of the low vapor pressure liquid material is controlled by a flow rate control unit, and the flow rate of the low vapor pressure liquid is supplied to an evaporator and evaporated into vapor there; and the vapor is fed to the deposition chamber through a vapor feed passage provided with heating means for preventing the vapor from re-liquefying, whereby the liquid material for deposition is supplied stably and accurately.
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申请公布号 |
US6126994(A) |
申请公布日期 |
2000.10.03 |
申请号 |
US19970907007 |
申请日期 |
1997.08.06 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
MURAKAMI, SEISHI;HATANO, TATSUO |
分类号 |
H01L21/205;C23C16/00;C23C16/44;C23C16/448;H01L21/203;(IPC1-7):C23C16/00 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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