发明名称 THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE BOARD AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board excellent in ultraviolet-absorbing properties and capable of simultaneous exposure of both surfaces. SOLUTION: This wiring board is prepared by forming a circuit on a copper clad laminate board obtained by using a prepreg obtained by impregnating a fiber substrate with a thermosetting resin composition, as a varnish, comprising as essential ingredients a thermosetting resin, a naphthalimide derivative represented by the formula and 4-methyl-7-diethylaminocoumarin followed by drying.
申请公布号 JP2000273314(A) 申请公布日期 2000.10.03
申请号 JP19990078681 申请日期 1999.03.23
申请人 HITACHI CHEM CO LTD 发明人 TAKADA KOSUKE;MURAI AKIRA;OSE MASAHISA
分类号 H05K1/03;B32B15/08;C08J5/24;C08K5/15;C08K5/1545;C08K5/3432;C08L63/00;C08L101/00;(IPC1-7):C08L101/00;C08K5/154;C08K5/343 主分类号 H05K1/03
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