发明名称 |
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE BOARD AND PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board excellent in ultraviolet-absorbing properties and capable of simultaneous exposure of both surfaces. SOLUTION: This wiring board is prepared by forming a circuit on a copper clad laminate board obtained by using a prepreg obtained by impregnating a fiber substrate with a thermosetting resin composition, as a varnish, comprising as essential ingredients a thermosetting resin, a naphthalimide derivative represented by the formula and 4-methyl-7-diethylaminocoumarin followed by drying.
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申请公布号 |
JP2000273314(A) |
申请公布日期 |
2000.10.03 |
申请号 |
JP19990078681 |
申请日期 |
1999.03.23 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
TAKADA KOSUKE;MURAI AKIRA;OSE MASAHISA |
分类号 |
H05K1/03;B32B15/08;C08J5/24;C08K5/15;C08K5/1545;C08K5/3432;C08L63/00;C08L101/00;(IPC1-7):C08L101/00;C08K5/154;C08K5/343 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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