| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for closely bonding a PEEK resin film bad in the close adhesiveness to a metal and also inferior to bending strength to a metal substrate by coating and a PEEK resin film good in close adhesiveness and processability. SOLUTION: A PEEK resin film is formed on the surface of a pretreated metal substrate in an integrally and closely bonded state in such a state that the crystallinity of a PEEK resin is set to a range of 20-40%. The PEEK resin film is formed on the surface of the metal substrate subjected to pretreatment such as washing, surface roughening, plating or chemical conversion treatment in a thickness of 100-2,000μm by an arbitrary coating method such as an electrostatic coating or fluidizing dipping method. This coated metal substrate is introduced into a baking furnace to melt the PEEK resin and the furnace temp. is lowered to form the PEEK resin film so that the crystallinity of the PEEK resin is set to the range of 20-40%.
|
