发明名称 |
Package removal for FBGA devices |
摘要 |
Aspects for removing device packaging from an FBGA (fine pitch ball grid array) package are described. In an exemplary method aspect, the method includes recessing a predetermined area of the FBGA package, and exposing an integrated circuit die covered by the FBGA package. Device analysis is then performed on the exposed die. The step of recessing further includes milling the predetermined area, while the step of exposing includes chemically etching the FBGA package.
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申请公布号 |
US6127194(A) |
申请公布日期 |
2000.10.03 |
申请号 |
US19980208826 |
申请日期 |
1998.12.09 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
MAHANPOUR, MEHRDAD;MASSOODI, MOHAMMAD |
分类号 |
G01N1/32;G01R31/28;(IPC1-7):G01R31/26 |
主分类号 |
G01N1/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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