| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition containing no impurities including halogens, causing no insulation drop of the insulation films therefrom, and useful for insulation films for build-up circuit boards by including an alicyclic epoxy resin, an epoxy curing agent, and a polybutadiene compound, etc. SOLUTION: This composition is obtained by including (A) an alicyclic epoxy resin, (B) an epoxy curing agent intended for the resin A, (C) a polybutadiene compound, silica powder, or a monomer or precursor capable of forming a polyimide or polyetherimide when heated; wherein the component A which is an epoxy resin having a cyclohexane skeleton, is pref. a bifunctional epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, or a mixture of two or more thereof; and the component B is pref. a phenol novolak resin or acid anhydride, or a mixture of a silanol-contg. compound and a metal-contg. compound.
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