| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing suitable for transfer molding of a package having a large thickness ratio of the surface to the back surface and the like and good in filling properties and workability and to provide a sealed semiconductor device. SOLUTION: This sealing resin composition comprises, as essential ingredients, a thermosetting resin (A), a polar solvent (B) and a silica filler (C), and the silica filler (C) has a maximum particle size of not more than 200μm and an average particle size of at least 25μm and not more than 50μm and is contained in an amount of 300-600 pts.wt. based on 100 pts.wt. of the thermosetting resin (A). The sealed semiconductor device is obtained by sealing a semiconductor chip with a cured product of this resin composition for sealing.
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