发明名称 EXCIMER LASER BEAM MACHINING DEVICE AND ADJUSTMENT METHOD OF MACHINING ENERGY INTENSUTY OF EXCIMER LASER BEAM
摘要 <p>PROBLEM TO BE SOLVED: To provide an excimer laser beam machining device of high machining efficiency. SOLUTION: This machine 10 is provided with an oscillator 11 of an excimer laser beam and a mask 14 to regulate the excimer laser beam emitted from the oscillator to a prescribed pattern, and is an excimer laser beam machine to machine a work with the excimer laser beam pattern-regulated by the mask. Further, the device is provided with an angle adjustment jig 16 which holds the work, rotates the work so that a face to be machined of the work is set to a set angle for a radiation direction of the excimer laser beam and positions the face to be machined, and an optical attenuator 54 which is arranged between the oscillator 11 of an excimer laser beam and the mask and attenuates the excimer laser beam with a prescribed attenuation rate in accordance with the relation between an angle of the face to be machined with respect to the radiation direction of the excimer laser beam and a required energy of the excimer laser beam based on the set angle of the face to be machined for the radiation direction of the excimer laser beam.</p>
申请公布号 JP2000271770(A) 申请公布日期 2000.10.03
申请号 JP19990079818 申请日期 1999.03.24
申请人 SONY CORP 发明人 TODA MASASHI;YANAGISAWA YOSHIYUKI;TAKAI YUICHI
分类号 B23K26/02;B23K26/00;B23K26/06;B23K26/08;H01S3/00;H01S3/10;(IPC1-7):B23K26/02 主分类号 B23K26/02
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