发明名称 |
Method for treating semiconductor wafers with corona charge and devices using corona charging |
摘要 |
A method of treating the surface of a semiconductor wafer is disclosed for making the wafer resistant to particle adhesion, the method involving the application of a uniform corona charge to the wafer surface. The corona charge is deposited on the wafer using commercially available tools, and if necessary, it may be later removed by immersing the wafer in deionized water or by depositing a compensating corona charge over the wafer of opposite polarity relative to the originally-applied charge.
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申请公布号 |
US6127289(A) |
申请公布日期 |
2000.10.03 |
申请号 |
US19970924268 |
申请日期 |
1997.09.05 |
申请人 |
LUCENT TECHNOLOGIES, INC. |
发明人 |
DEBUSK, DAMON KEITH |
分类号 |
H01L21/326;(IPC1-7):H01L21/477;H01L21/26 |
主分类号 |
H01L21/326 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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