| 摘要 |
<p>PROBLEM TO BE SOLVED: To restrict dusts, and reliably fix a wafer to and detach from a hand by a method wherein a margin part of a wafer plane is pressed from both sides with a small force. SOLUTION: A wafer 10 is transfered by a process hand 46 in a predetermined posture during cleaning. The process hand 46 is constituted by a holder bracket 100 on which a margin part of a wafer plane abuts when grasping the wafer; and a holder can 110 for urging the margin part of the wafer 10 in a direction of a butting on the holder bracket 100 when receiving the wafer. Here, the holder can 110 (using a polyimide resin, etc., having little possibility of generating dusts) has a lever part 112 and a stage part 114 integral with each other, and is rotatably provided around a horizontal axis 108. The process hands 46 are arranged, for example, at four positions in an outer periphery of the wafer instead of holder pins, and the margin parts on an upper face and lower face of the wafer are pinched at four positions between a lower face of the holder bracket 100 and an upper face of the holder cam 110.</p> |
