| 摘要 |
Process for physical isolation of regions (110) of a substrate board (100) comprising the following steps:a) formation of trenches (106) in the substrate, delimiting regions of the substrate (110),b) placement of a liquid bonding material (120) in the trenches, which can solidify and bond to the substrate board (100) when in the solid state,c) solidification of the bonding material.Application to isolation of electronic, optical, mechanical or magnetic components. |
