发明名称 TAPE CARRIER PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To obtain a tape carrier package with a sealing resin cover film, where resin specified in an application range by the demand of a user is applied. SOLUTION: A plastic film 1 is pasted on a sealing resin 5 applied on a user demand resin application range 10, by which the adhesive force of the sealing resin 5 acts on the film 1, and the sealing resin 5 is restrained from flowing out, separating from the film 1 by the adhesive force and restricted within the application range 10. Therefore, the sealing resin 5 hardly flows out of the resin application range 10 and becomes uniform in film thickness, and a tape carrier package mounted with an IC 9 can be improved in strength.</p>
申请公布号 JP2000269249(A) 申请公布日期 2000.09.29
申请号 JP19990070168 申请日期 1999.03.16
申请人 NEC CORP 发明人 SUGITA MASAHIRO
分类号 H01L21/60;H01L21/56;(IPC1-7):H01L21/56 主分类号 H01L21/60
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