| 摘要 |
PROBLEM TO BE SOLVED: To enable inspection, even if a density of the point of a test object on a printed circuit board to be inspected is high. SOLUTION: Inspection probe pins PB to the number corresponding to the number of inspection points of a wiring pattern on a board 4 are planted on a lower-part inspection jig 2B. The probe pins PB are in electrical contact with base parts PB', and the probe pins PB or the base parts PB' have springs within, and the probe pins PB have a enough length for the heads thereof to be exposed to the surface of a protective board. A distribution density of the head parts of the probe pins PB is smaller than that of the root parts thereof.
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