| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable surface wave device in which the occur rence of connection failures at metallic bump junctions is suppressed, by reduc ing the stresses applied to the junctions when joining a cap to a base member. SOLUTION: A surface wave device is constituted in such a way that a surface wave element 20 is supported, fixed, and electrically connected by and to a base member 10 through metallic bumps 51, and a cap 30 is joined to the base 10 with a brazing filler material composed of high-melting-point solder. The base 10 and the cap 30 are selectively constituted so that a relation 0.9<=b/a<=1.6 (where, a and b respectively represent the coefficients of linear expansion of the members 10 and 30) may be met between the members 10 and 30.
|
