| 摘要 |
PROBLEM TO BE SOLVED: To reduce the temperature increase of an electrode and to prevent the difference in the soldering property with packaged parts from occurring by providing an insulation plate in contact with the sealing end of a capacitor body and an appropriate gap between a connection terminal and the insulation plate at a lower-surface part. SOLUTION: A chip-type capacitor 1 is led through a sealing member for sealing the opening of an aluminum armor case 3 for accommodating a capacitor element inside. Then, an insulation plate 6 is arranged in contact with the sealing end face of the capacitor body 3 where a lead terminal is led. The insulation plate 6 is made of resin with a specific thickness and with electrical insulation property, and has a connection terminal 7 being formed along a packaging surface at a specific angle so that a gap is formed between the contacting surface with a capacitor body 2 and a packaging surface at the opposite side. The lead terminal is engaged into the end part of the connection terminal 7 for forming in one piece, and the connection terminal 7 is connected to the lead terminal, thus preventing the heat of the connection terminal 7 from being diffused in soldering for packaging and extremely reducing the difference in soldering property with other packaged parts.
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