发明名称 ELECTRONIC COMPONENT-MOUNTING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting method an apparatus for improving the mounting tact by reducing time required for detecting the position deviation of electronic component being retained by a fitting head. SOLUTION: The positional deviation of a retention position is detected from an image that is obtained by picking up the image of electronic component 50, by moving a fitting head 40 retaining the electronic component 50 at a prescribed speed on a line sensor camera 1. In the electronic component 50 requiring detection accuracy, an image from the line sensor camera 1 is stored in an image memory 28, based on a small camera scale setting from a pitch- setting part 9. In the electronic component 50 where the detection accuracy may be low, a camera scale is increased, thus increasing the traveling speed of the fitting head 40, and hence reducing the entire mounting tact of a circuit substrate by switching the traveling speed according to the type of the electronic component 50.
申请公布号 JP2000269694(A) 申请公布日期 2000.09.29
申请号 JP19990070028 申请日期 1999.03.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NOUDO AKIRA;HACHITANI EIICHI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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