| 摘要 |
PROBLEM TO BE SOLVED: To reuse a frame by releasing a tape so that adhesives are not left behind in the frame. SOLUTION: A fastening processing, a gripping processing, and a separating processing are sequentially effected. In the fastening processing, upper and lower faces of a frame 2 are interposed by a frame fixing tool 1, and are held at a fixed position, and in the gripping processing, the upper and lower faces of a tape 4 ranging between parts 2a and 2b confronting each other in the frame 2 are interposed by a tape fixing metal fitting 6. In the separating processing, the tape fixing tool 6 for fixing the tape 4 is forcible relatively moved to a side in which the tape 4 is adhered to the frame 2, and the tape 2 after a semiconductor device is cut is forcibly released from the frame 2, including an adhesives coated face. |
