| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for machining a lead frame of a semiconductor element that is manufactured at low cost by simplifying the whole composition and has not use for a dedicated work shop for a cutting work for an unloaded element for efficient work, a method for machining it, and a semiconductor element. SOLUTION: A lower metal mold 11 to an upper surface of whose tip part a lead frame setting part 12 is provided while a die 13 is provided on the center part of the lead frame setting part; an upper metal mold part 14 to whose tip part a punch 16 is so fitted as to face the die 13 while vertical movement is allowed, and whose rear end part is fixed onto the rear end part of the lower metal mold part 11 into a body; an operation part 29 whose tip part is fitted rotatably to the tip part of the upper metal mold part 14 to lower the punch 16, when rotation is performed so as to lower the rear end part of the operation part, and which is always urged to raise the rear end part by rotating; and a lead frame holding member 18 that holds a lead frame of a semiconductor element thereonto, and detachably set to the lead frame setting part 12; are provided. |
