ELECTRONIC COMPONENT-MOUNTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an electronic component-mounting apparatus for reliably and positively mounting bump-system electronic components by a rotary-type mounting head. SOLUTION: An automatic adjustment-weighting device 41 is arranged at a component-mounting position for mounting electronic components 2 that are sucked and retained by a chucking nozzle 7 by the vertical movement of the shucking nozzle 7. The automatic adjustment-weighting device 41 gives a prescribed press force, that is adjusted according to the electronic components 2 to the chucking nozzle 7 and presses the electronic components 2 to a circuit substrate 3, only when the electronic components 2 of a type to be mounted on a plane via a bump are mounted.