发明名称 MANUFACTURE OF FILM CARRIER TAPE FOR SEMICONDUCTOR PACKAGE
摘要 PROBLEM TO BE SOLVED: To fabricate a high density film carrier tape by installing a punch unit in an automatic control punching machine and forming a group of plural pattern holes in a base film tape in one-time punching to make a film carrier tape. SOLUTION: A punch unit is installed in an automatic control punching machine, and a first group of four pattern holes 161 are formed in the corner to the upper right of a base film tape 28. Next, a second group of four pattern holes 162 are formed in the same base film 28. Likewise, a third group of four pattern holes 163 are formed in the base film 28. Thereafter, a work holder is moved backward and to the left, and a fourth group of pattern holes 164 and a fifth group of pattern holes 165 are formed. This operation is repeated to form all the pattern holes in a next one-repetition unit to make a film carrier tape.
申请公布号 JP2000269273(A) 申请公布日期 2000.09.29
申请号 JP19990073223 申请日期 1999.03.18
申请人 MITSUI MINING & SMELTING CO LTD 发明人 YOTSUMOTO NORIO
分类号 H01L21/60;C09J7/02;(IPC1-7):H01L21/60 主分类号 H01L21/60
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