| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, equipped with an outer electrode or a dummy electrode without producing resin burrs. SOLUTION: A part of an upper mold 2 is made to vacuum-chuck metal plates 6, the upper mold 2 vacuum-chucking up the metal plates 6 is placed on a lower mold 3 previously mounted with a semiconductor element 4 to pair up with it, sealing resin is injected into paired molds 2 and 3, the metal plates 6 are partially formed in one piece with the injected resin which excludes their parts chucked by the upper mold 2, and the injected resin is cured, by which a semiconductor device integrally equipped with the metal plates 6 are mostly exposed to the outside is obtained.
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