URETHANE OLIGOMER, RESIN COMPOSITIONS THEREOF, AND CURED ARTICLE THEREOF

摘要

A resin and a resin composition which each can be diluted with water and gives a cured article excellent in properties (curability, adhesion, and water resistance); a resin composition which gives a cured article excellent in flexibility, soldering heat resistance, etc., can be developed with an organic solvent or a dilute alkali solution, and is suitable as a solder resist and an interlayer dielectric; a photosensitive resin composition which is suitable as an etching resist and a cover lay; and a photosensitive film comprising the photosensitive resin composition. The urethane oligomer (A) is obtained by reacting a polyol compound (a), a polybasic acid anhydride (b) having at least two anhydride groups per molecule, a polyisocyanate compound (c), and a hydroxy compound (d) having an ethylenically unsaturated group. The resin compositions comprise (1) the oligomer (A), (2) at least one resin selected among unsaturated polycarboxylic acids (B), reactive diluents (C-1) such as (meth)acrylates, nonreactive diluents (C-2) such as Carbitol acetate, and thermoplastic polymers (D), and (3) a photopolymerization initiator.