PHOTOSENSITIVE RESIN COMPOSITION FOR RAPID PROTOTYPING AND A PROCESS FOR THE MANUFACTURE OF 3-DIMENSIONAL OBJECTS

摘要

The invention relates to a photosensitive resin composition for rapid prototyping comprising:a. about 30 wt. % to about 70 wt. % of at least two epoxy resins, at least one of these resins is solid at room temperature and comprises aromatic groups, and at least one of these resins is liquid, having a viscosity at 25° C. lower than about 1,000 Pa.s,b. about 15 wt. % to about 50 wt. % of at least one multifunctional acrylate compoundc. about 5 wt. % to about 30 wt. % of a hydroxyfunctional compoundd. about 1 wt. % to about 6 wt. % cationic photoinitiatore. about 1 wt. % to about 6 wt. % free radical photoinitiator.The invention further relates to a process for the manufacturing of 3-dimensional objects, known as rapid prototyping, wherein the photosensitive resin composition is used.