发明名称 |
Method and cleaner composition for stripping copper containing residue layers |
摘要 |
A cleaner composition for removing from within a microelectronic fabrication a copper containing residue layer in the presence of a copper containing conductor layer, and a method for stripping from within a microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer. The cleaner composition comprises: (1) a hydroxyl amine material; (2) an ammonium fluoride material; and (3) a benzotriazole (BTA) material. The cleaner composition contemplates the method for stripping from within the microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer.
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申请公布号 |
US6123088(A) |
申请公布日期 |
2000.09.26 |
申请号 |
US19990467135 |
申请日期 |
1999.12.20 |
申请人 |
CHARTERED SEMICONDUCOTOR MANUFACTURING LTD. |
发明人 |
HO, KWOK KEUNG PAUL |
分类号 |
C11D7/32;C11D11/00;H01L21/02;H01L21/311;H01L21/321;H01L21/768;H05K3/26;(IPC1-7):B08B3/08 |
主分类号 |
C11D7/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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