发明名称 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND ITS BONDING SHEETS
摘要 PROBLEM TO BE SOLVED: To obtain a low-viscosity pressure-sensitive adhesive composition preparable at a high solid concentration, excellent in bonding characteristics at high temperatures and good in heat resistance. SOLUTION: This pressure-sensitive adhesive composition comprises a polymer which is a polymer of a monomer containing >=50 wt.% of an acrylic monomer represented by the general formula CH2=C(R1)COOR2 (R1 is hydrogen or methyl group; R2 is a 2-14C alkyl group) and having >=60,000 number-average molecular weight, >=100,000 weight-average molecular weight and >=50% introduction ratio of functional groups into molecular chain terminals as a principal ingredient and a tackifier resin having alcoholic hydroxyl groups in an amount of 10-70 pts.wt. based on 100 pts.wt. of the principal ingredient.
申请公布号 JP2000265137(A) 申请公布日期 2000.09.26
申请号 JP19990071442 申请日期 1999.03.17
申请人 NITTO DENKO CORP 发明人 TAMAI HIRONOBU;WADA HIROSHI
分类号 C09J7/02;C09J133/04;(IPC1-7):C09J7/02 主分类号 C09J7/02
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