| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting structure of a chip resistor which can reduce shearing distortion by increasing solder thickness, and a mounting method of the chip resistor. SOLUTION: In a chip resistor 10, component electrodes 12, 13 are formed on the upper, lower and side surfaces in the right and the left end portions of an alumina substrate 11. On the upper surface of the alumina substrate 11, a resistor 14 is formed between the component electrodes 12, 13. On the upper surface of the alumina substrate 11, a glass thick film 15 is formed on the upper surface and the periphery of the resistor 14. A glass thick film 17 is formed also on the lower surface (back) of the alumina substrate 11 and is arranged in contact with a printed wiring board 1. The component electrodes 12, 13 are bonded to soldering pads 2, 3 of the printed wiring board 1 by using solder 18, 19. The glass thick film 17 acts as a spacer between the chip resistor 10 and the printed wiring board 1.</p> |
