| 摘要 |
PROBLEM TO BE SOLVED: To prevent an external lead terminal from being broken due to application of an external force (vibration). SOLUTION: A package for accommodating a semiconductor element is formed by depositing a wiring layer 5, where the electrode of a semiconductor element is connected to the outer surface of an insulation container with an empty part for accommodating the semiconductor element inside, and at the same time an external lead terminal 7 is brazed to the wiring layer 5. Young's modulus of the external lead terminal 7 is in the range of 7,000 kgf/mm2 to 13,000 kgf/mm2, and a plated layer 9 made of nickel with a particle diameter of 2 μm-5 μm is deposited on the outer surface. |
