| 摘要 |
PROBLEM TO BE SOLVED: To completely remove resin burr generated between an external connection lead and a package resin body. SOLUTION: In a surface mount semiconductor device where the rear surface of a die pad bonded with a semiconductor chip is exposed to the upper surface of a package and the end part 17-1 of an external connection lead 17 is exposed at the lower surface 18 part of the package, the package is formed by performing plastic molding while setting a level difference 20 at a bend 19 of the lead proximate to the lower surface 18 of the package. |
