| 摘要 |
PROBLEM TO BE SOLVED: To obtain a chip component which can be mounted on an electronic component board at a high density with ease. SOLUTION: A chip component 1 having a chip component body 10 and electrodes 12a and 12b arranged at both ends of the body 10. A recess 15 is formed in either one of the upper and lower surfaces of the body 10 and a projection 14 is formed on the other surface, whereby the projection 14 can engage with the recess 15 when the components 1 are mounted one upon another vertically.
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